Communication Transmission Material Solutions

PCPMMA is used for smartphone back covers, essentially employing an engineering plastic solution to approximate the visual appearance of glass while retaining certain advantages such as impact resistance and lightweight properties.

biosensor

The electrical insulation, chemical inertness, and patternable surface of PEEK (e.g., via photolithography or laser etching) make it suitable as a substrate or insulating layer for sensors. Its high-temperature resistance allows for post-processing at elevated temperatures after immobilizing biomolecules to enhance binding strength.

Flexible circuit substrate, insulation layer, encapsulation layer

Used as a substrate or cover film for flexible PCBs and FPCs, it serves as the signal trace layer in wearable devices such as smart bracelets, earphones, and health monitoring patches. Compared to PI, PEI has a higher glass transition temperature (Tg) and a slightly lower coefficient of thermal expansion, resulting in greater dimensional stability during high-temperature soldering and multilayer lamination processes. This reduces the risks of warping and delamination.

Dafu

Optical/Printable Grade Series

Functional film series

PC/PMMA composite sheet Series

Special Film Series

PCPMMA is used for smartphone back covers

biosensor

Flexible circuit substrate, insulation layer, encapsulation layer

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